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M31-GRN360-K1MK-V lead free solder paste

M31-GRN360-K1MK-V lead free solder paste
About this item
Price : $73
MOQ : 1 pcs
Weight : 0.5 KG
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Product detail
Product description:

M31-GRN360-K1MK-V lead-free solder paste is used for tinning Hashboard ASIC chips, bonding hash board heat sinks, tinning CPU main control chips, tinning GPU particles, etc. Senju's Halogen paste solder M31-GRN360-K1MK-V is an environmentally friendly solder paste product that achieves the same solubility as conventional products without adding any halogen compounds. Moreover, even if it is halogen-free, it still has the durability required for high-temperature and long-term preheat, and it can also correspond to air reflow. The solder joints are even and round, the melting point temperature is accurate, and there are no air bubbles.



Product parameters:

Melting point: 217°C

Cleaning angle: no cleaning

Type: Lead-free solder paste

Active: High RA

Alloy composition: Sn95.75/Ag3.5/Cu0.75

Model: M31-GRN360-K1MK-V

Viscosity: 200 (Pa·S)

Particle size: 20-38 (um)

Specification: 500g/bottle

Advantages:

• The shelf life is long

• Excellent discharge performance for printing or syringe type

• Good weldability, tiny solder balls are not easy to produce after welding

• RMA type, the practical application of low residue and water-soluble solder paste

• Easy cleaning of Flux residue





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